Method for manufacturing electronics assembly and electronics assembly

ABSTRACT

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and the second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation U.S. patent application Ser. No.17/704,264 filed Mar. 25, 2022, the disclosure of this application isexpressly incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates in general to functional, integratedstructures or electronics assemblies incorporating various functionalfeatures such as electronic, mechanical or optical elements. Inparticular, however not exclusively, the present invention concernsconnecting electronic modules or sub-assemblies to substrates forproducing such structures or assemblies.

BACKGROUND

There exists a variety of different stacked assemblies and multilayerstructures in the context of different functional ensembles e.g. in thefield of electronics and electronic products. The motivation behind theintegration of functionalities involving e.g. electronics, mechanical oroptical features may be as diverse as the related use contexts.Relatively often size savings, weight savings, cost savings, or justefficient integration of components is sought for when the resultingsolution ultimately exhibits a multilayer nature. In turn, theassociated use scenarios may relate to product packages or casings,visual design of device housings, wearable electronics, personalelectronic devices, displays, detectors or sensors, vehicle interiors,antennae, labels, vehicle electronics, etc.

Electronics such as electronic components, ICs (integrated circuit), andconductors, may be generally provided onto a substrate element by aplurality of different techniques. For example, ready-made electronicssuch as various surface mount devices (SMD) may be mounted on asubstrate surface that ultimately forms an inner or outer interfacelayer of a multilayer structure. Additionally, technologies fallingunder the term “printed electronics” may be applied to actually produceelectronics directly and additively to the associated substrate. Theterm “printed” refers in this context to various printing techniquescapable of producing electronics/electrical elements from the printedmatter, including but not limited to screen printing, flexography, andinkjet printing, through a substantially additive printing process. Theused substrates may be flexible and printed materials organic, which ishowever, not always the case.

Furthermore, the concept of injection molded structural electronics(IMSE) involves building functional devices and parts therefor in theform of a multilayer structure or assembly, which encapsulateselectronic functionality as seamlessly as possible. Characteristic toIMSE is also that the electronics is commonly manufactured into a true3D (non-planar) form in accordance with the 3D models of the overalltarget product, part or generally design. To achieve desired 3D layoutof electronics on a 3D substrate and in the associated end product, theelectronics may be still provided on an initially planar substrate, suchas a film, using two dimensional (2D) methods of electronics assembly,whereupon the substrate, already accommodating the electronics, may beformed into a desired three-dimensional, i.e. 3D, shape and subjected toovermolding, for example, by suitable plastic material that covers andembeds the underlying elements such as electronics, thus protecting andpotentially hiding the elements from the environment. Further layers andelements may be naturally added to the construction.

In many cases, there have been difficulties in obtaining robustfunctional, integrated structures, or assembles, in which bothmechanical and especially electrical connections, as well as otherfunctionalities, operate reliably while still achieving cost-effectivesolutions. Typically, the connections are made by attaching thecomponents and/or sub-assemblies to the substrate from below, that is,between the components and/or sub-assemblies and the substrate to whichthey are connected. The electrical connection means, such as connectorsand/or pads or the like, used for connecting are arranged to be “under”the components and/or sub-assemblies which can result in a complex,laborious, and costly way of producing the assembly.

SUMMARY

The objective of the present invention is to at least alleviate one ormore of the above drawbacks associated with the known solutions in thecontext of integral electronics assemblies including electronics modulesor sub-assemblies, and especially connections thereof.

The objectives of the invention are reached by a method formanufacturing an electronics assembly and an electronic assembly asdefined by the respective independent claims.

According to a first aspect, a method for manufacturing an electronicsassembly is provided. The method comprises obtaining or producing anelectronics module, wherein the electronics module comprises a firstcircuitry on a first surface at a first side of a circuit board, atleast one electronics component on the circuit board and in electricalconnection with the first circuitry, and at least one first connectionportion on the first surface and/or an adjacent side surface at aperipheral portion of the circuit board, wherein the at least one firstconnection portion is electrically connected to or is comprised in thefirst circuitry. The method further comprises arranging the electronicsmodule on a second substrate, such as on a thermoformable film or sheet,preferably of plastic material, comprising a second connection portionconnected to a second circuitry on a surface of the second substrate,wherein a second surface of the circuit board, being on the oppositesecond side than the first surface, faces the second substrate. Stillfurther, the method comprises arranging electrically conductive jointmaterial onto the first and the second connection portions to extendbetween them for electrically connecting the electronics module to thesecond circuitry via the electrically conductive joint material.

The circuit board, or at least a portion thereof, may be one selectedfrom the group consisting of: a printed circuit board (PCB), an,optionally low temperature, co-fired ceramic circuit board, an FR4circuit board, a flexible PCB, a rigid-flex PCB.

In many embodiments, the circuit board may be rigid or at least theportion may be rigid, such as a PCB, an, optionally low temperature,co-fired ceramic circuit board, an FR4 circuit board.

The electrically conductive joint material may be one selected from thegroup consisting of: solder material, such as melted or stencil printedsolder, conductive adhesive, conductive ink, conductive tape or film,for example, asymmetric conductive tape or film, or anisotropicconductive film (ACF).

In various embodiments, the electrically conductive joint material maybe at least initially dispensable, preferably flowable, such asconductive adhesive or ink, or melted or stencil printed soldermaterial, and the arranging of the electrically conductive jointmaterial may comprise dispensing the electrically conductive jointmaterial on the first and the second connection portions.

In various embodiments, the first connection portion may comprise one ora plurality of conductive pads at the peripheral portion on the firstsurface at the first side of the circuit board.

Alternatively or in addition, the first connection portion may includeone or several castellated or plated edges or half-holes.

Furthermore, the first connection portion may comprise one or severalvias or plated holes.

In various embodiments, the arranging of the electronics module maycomprise attaching the electronics module to the second substrate by asecond adhesive, preferably an electrically non-conductive adhesive,provided on the second side of the electronics module.

In various embodiments, the method may comprise applying a conformalcoating, an encapsulant or glob top layer onto the first surface toembed at least the at least one electronics component.

Furthermore, the method may comprise forming, such as thermoforming, thesecond substrate at least locally from a planar shape to exhibit anon-planar or 3D shape, such as a convex and/or concave surface portion,prior to or after the arranging of the electronics module on the secondsubstrate. The forming of the second substrate may, preferably, however,not necessarily, occur after the arranging of the electronics module onthe second substrate. In some embodiments, the forming may occur priorto said arranging.

The method may, in some embodiments, comprise providing a trench, suchas including or being a depression or an indentation, to the secondsubstrate, the trench having a shape and a lateral size such that theelectronics module fits laterally into the trench. Furthermore, thetrench may be provided by thermoforming the second substrate.

In various embodiments, the circuit board may comprise a rigid portionand a flex portion attached to each other, wherein the at least onefirst connection portion is comprised in the peripheral portion of theflex portion.

In some embodiments, the at least one electronics component may be aconnector for providing electrical connection between an external entityand the first circuitry.

Still further, the method may comprise arranging a third substrate, suchas on a thermoformable film or sheet, preferably of plastic material, onthe opposite side of the electronics module relative to the secondsubstrate.

Furthermore, the method may comprise forming, such as thermoforming, thethird substrate, alternatively or in addition to the forming of thesecond substrate, at least locally from a planar shape to exhibit anon-planar or 3D shape, such as a convex and/or concave surface portion,prior to or after the provision of the molded material layer. Thus, themolded material layer may be provided first on the second substrate andthen the third substrate is provided onto the molded material layer, orthe molded material layer may be provided between the second and thethird substrates.

Furthermore, in some embodiments, the at least one electronics componentmay be a segment display, such as a 7-segment, 8-segment, or 16-segmentdisplay.

Furthermore, the third substrate may be attached to the first surface ofthe circuit board and/or the at least one electronics component by thirdadhesive, such as transparent adhesive or film.

Alternatively or in addition, the method may comprise removing a portionof the second substrate to expose the circuit board for arranging the atleast one electronics component on the exposed portion of the secondsurface.

Furthermore, the third substrate may be attached to the first surface ofthe circuit board by third adhesive, such as anisotropic conductiveadhesive or film.

In an embodiment, the method may comprise arranging a display to a spaceleft by the removed portion of the third substrate.

The circuit board may comprise a cavity on the first surface, and themethod may then comprise removing a portion of the third substrate toexpose the cavity for arranging one or several electronics components,such as a passive infrared sensor, to the cavity.

In some embodiments, the method may comprise attaching a second circuitboard to the third substrate on the side facing or to be facing theelectronics module, wherein the second circuit board comprises athrough-hole, and removing a portion of the third substrate to exposethe through-hole for arranging one or several electronics components,such as a passive infrared sensor, to a cavity defined by thethrough-hole and the circuit board.

In various embodiments, the method may comprise molding, preferablyinjection molding, material, such as thermoplastic material, onto a sideof the second substrate having the electronics module and at leastpartly embedding the electronics module.

The method may also comprise removing a portion of the second substrateafter the arranging of the electronics module so as to expose at leastpartly the electronics module on the opposite side thereof relative tothe at least one electronics component.

In some embodiments, the at least one electronics component may includeone or more capacitive sensing elements, such as electrodes.Furthermore, the electronics module may comprise a ground layer on theopposite side thereof relative to the one or more capacitive sensingelements.

In some other embodiments, the at least one electronics component mayinclude one or more inductive sensors or force or pressure sensingelements.

In various embodiments, the method may comprise arranging a protectivering onto the circuit board and around the at least one electronicscomponent, the protective ring optionally comprising a cover on theopposite side relative to the circuit board. Furthermore, the circuitboard may comprise an antenna element, such as a printed antenna or aceramic antenna.

Alternatively or in addition, the method may comprise providing pottingmaterial into a space defined by the protective ring and the circuitboard, and optionally the cover.

In various embodiments, the protective ring may be a reflector orcomprise reflective inner surface.

Alternatively or in addition, the cover may be a diffuser, such as beingmade of diffuse material.

The electronics module may further comprise, in various embodiments, anelectrical energy storage, such as a battery.

In an embodiment, the method may comprise arranging a gas sensor ontothe circuit board, and providing a gas vent in fluid communication withthe gas sensor by removing a portion of the third substrate.

In an embodiment, the method may comprise arranging an audio device onthe circuit board. Alternatively, the method may comprise arranging ahaptic actuator like linear resonance actuator (LRA) or eccentricresonance motor (ERM).

According to a second aspect, an electronics assembly is provided. Theelectronics assembly comprises a second substrate, such as athermoformable film or sheet, preferably of plastic material, comprisinga second connection portion connected to a second circuitry on a surfaceof the second substrate. The electronics assembly also comprises anelectronics module, wherein the electronics module comprises: a firstcircuitry on a first surface at a first side of a circuit board, atleast one electronics component on the circuit board and in electricalconnection with the first circuitry, and at least one first connectionportion on the first surface and/or an adjacent side surface at aperipheral portion of the circuit board, wherein the at least one firstconnection portion is electrically connected to or is comprised in thefirst circuitry. A second surface of the circuit board, being on theopposite second side than the first surface, faces the second substrate.

Furthermore, the electronics assembly comprises electrically conductivejoint material, such as one selected from the group consisting of:solder material, melted or stencil printed solder, conductive adhesive,conductive ink, conductive tape, arranged onto the first and the secondconnection portions to extend between them to electrically connect theelectronics module to the second circuitry via the electricallyconductive joint material.

The electronics assembly may, preferably, comprise a molded, such asinjection molded, material layer embedding the electronics module.

The molded material layer may, in general, comprise, for example, atleast one material selected from the group consisting of: polymer,organic material, biomaterial, composite material, thermoplasticmaterial, thermosetting material, elastomeric resin, PC, PMMA, ABS, PET,copolyester, copolyester resin, nylon (PA, polyamide), PP(polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS),TPSiV (thermoplastic silicone vulcanizate), and MS resin. The moldedmaterial layer may be transparent, translucent, or opaque.

The electronics assembly may, preferably, comprise a third substrate onthe opposite side of the electronics module relative to the secondsubstrate. The molded material layer may, thus, be arranged between thethird substrate and the second substrate.

In some embodiments, there may be no molded material at the position ofthe electronics module since the electronics module extends from thesecond substrate to be in contact with the third substrate or at leastsome layer in contact with the third substrate, being other than themolded material layer.

The at least one electronics component may comprise at least onecomponent selected from the group consisting of: a microcontroller, anintegrated circuit, a transistor, a resistor, a capacitor, an inductor,a diode, a photodiode, a light-emitting diode, a semiconductor switch,electromechanical component, electro-optical component,radiation-emitting component, light-emitting component, LED(light-emitting diode), OLED (organic LED), side-shooting LED or otherlight source, top-shooting LED or other light source, bottom-shootingLED or other light source, radiation detecting component,light-detecting or light-sensitive component, photodiode,phototransistor, photovoltaic device, sensor, micromechanical component,switch, touch switch, touch panel, proximity switch, touch sensor,atmospheric sensor, temperature sensor, pressure sensor, moisturesensor, gas sensor, proximity sensor, capacitive switch, capacitivesensor, projected capacitive sensor or switch, single-electrodecapacitive switch or sensor, capacitive button, multi-electrodecapacitive switch or sensor, self-capacitance sensor, mutual capacitivesensor, inductive sensor, sensor electrode, micromechanical component,UI element, user input element, vibration element, sound producingelement, communication element, transmitter, receiver, transceiver,antenna, infrared (IR) receiver or transmitter, wireless communicationelement, wireless tag, radio tag, tag reader, data processing element,microprocessor, microcontroller, digital signal processor, signalprocessor, programmable logic chip, ASIC (application-specificintegrated circuit), data storage element, and electronic sub-assembly.

In various embodiments, possible additional layers or generallyfeatures, may be added into the electronics assembly by molding,lamination or suitable coating (e.g. deposition) procedure notforgetting other possible positioning or fixing techniques. The layersmay be of protective, indicative and/or aesthetic value (graphics,colors, figures, text, numeric data, etc.) and contain e.g. textile,leather or rubber materials instead of or in addition to furtherplastics. Additional elements such as electronics, modules, moduleinternals or parts, and/or optics may be installed and fixed e.g. at theouter surface(s) of the structure, such as the exterior surface of anincluded film or a molded layer depending on the embodiment. Necessarymaterial shaping/cutting may take place. For example, a diffuser may beproduced from locally lasering lightguide material. If provided with aconnector, the connector of the multilayer structure may be connected toa desired external connecting element such as an external connector ofan external device, system or structure, e.g. a host device. Forexample, these two connectors may together form a plug-and-socket typeconnection and interface. The multilayer structure may also be generallypositioned and attached herein to a larger ensemble such as anelectronic device such as a personal communications device, computer,household apparatus, industrial device, or e.g. a vehicle in embodimentswherein the multilayer structure establishes a part of vehicle exterioror interior, such as a dashboard.

The present invention provides a method for manufacturing an electronicsassembly and an electronics assembly. The present invention providesadvantages over known solutions in that the electronics module can beattached directly to film since only mechanical attachment have to used,if any, between the module and the film. Such bonding can be made strongand this allows to place module even directly under injection moldinggate in case there is injection molded material being applied to embedthe module. The direct attachment also makes thermal path to surface ofthe part shorter allowing better heat dissipation and more power permodule. The electrical connection can then be established via the edgeand or top of the module. Thus, the best properties for both themechanical and electrical connections can be obtained resulting inoverall more robust and cost-effective structure.

In many cases, the electrical connections may be done with a conductiveadhesive or ink. These can be dispensed so that it also covers part ofpad on circuit board. For example, by using single ink, differentmaterials used in assembly can be minimized if the contact pads and/ortraces have been made of the same ink, thus making the assembly morereliable and easier to adapt for, for example, functional safetyrequirements.

Various other advantages will become clear to a skilled person based onthe following detailed description.

The expression “a number of” may herein refer to any positive integerstarting from one (1), that is being one, at least one, or several.

The expression “a plurality of” may refer to any positive integerstarting from two (2), that is being two, at least two, or any integerhigher than two.

The terms “first”, “second” and “third” are herein used to distinguishone element from other element, and not to specially prioritize or orderthem, if not otherwise explicitly stated.

The exemplary embodiments of the present invention presented herein arenot to be interpreted to pose limitations to the applicability of theappended claims. The verb “to comprise” is used herein as an openlimitation that does not exclude the existence of also unrecitedfeatures. The features recited in the dependent claims are mutuallyfreely combinable unless otherwise explicitly stated.

The novel features which are considered as characteristic of the presentinvention are set forth in particular in the appended claims. Thepresent invention itself, however, both as to its construction and itsmethod of operation, together with additional objectives and advantagesthereof, will be best understood from the following description ofspecific embodiments when read in connection with the accompanyingdrawings.

BRIEF DESCRIPTION OF FIGURES

Some embodiments of the invention are illustrated by way of example, andnot by way of limitation, in the figures of the accompanying drawings.

FIG. 1 illustrates schematically an electronics assembly.

FIG. 2 illustrates schematically an electronics assembly.

FIG. 3 illustrates schematically an electronics module.

FIG. 4 illustrates schematically an electronics assembly.

FIG. 5 illustrates schematically an electronics assembly.

FIGS. 6A and 6B illustrate schematically an electronics assembly.

FIGS. 7A and 7B illustrate schematically an electronics assembly.

FIG. 8A illustrates schematically an electronics assembly.

FIG. 8B illustrates schematically an electronics module comprising aconnector.

FIG. 9 illustrates schematically an electronics assembly.

FIGS. 10A, 10B and 10C illustrate schematically an electronics assembly.

FIGS. 11A and 11B illustrate schematically an electronics assembly.

FIGS. 11C, 11D, 11E, 11F and 11G illustrate schematically electronicsmodules.

FIG. 12 illustrates schematically an electronics assembly.

FIGS. 13A, 13B and 13C illustrate schematically an electronics assembly.

FIG. 14 illustrates schematically an electronics module.

FIGS. 15A and 15B illustrate schematically an electronics assembly.

FIGS. 16A, 16B and 16C illustrate schematically an electronics assembly.

FIGS. 17A, 17B, 17C, 17D, and 17E illustrate schematically anelectronics assembly.

FIG. 18 illustrates schematically an electronics assembly.

FIG. 19 shows a flow diagram of a method for manufacturing an electronicassembly.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

FIG. 1 illustrates schematically an electronics assembly 100. Theelectronics assembly 100 may comprise a second substrate 21, such as athermoformable film or sheet, preferably of plastic material, comprisinga second connection portion 22 connected to or being comprised in asecond circuitry 23 on a surface of the second substrate 21. The secondcircuitry 23 may also comprise active and/or passive electronicscomponents, electromechanical components, optical components,semiconductor devices, as well as conductive pads, traces, etc.

Furthermore, the electronics assembly 100 may comprise an electronicsmodule 10. The electronics module may comprise a first circuitry 13 on afirst surface at a first side of a circuit board 11, at least oneelectronics component 12 on the circuit board 11 and in electricalconnection with the first circuitry 13, and at least one firstconnection portion 14 on the first surface and/or an adjacent sidesurface at a peripheral portion of the circuit board 11, wherein the atleast one first connection portion 14 is electrically connected to or iscomprised in the first circuitry 13. Still further, a second surface ofthe circuit board 11, being on the opposite second side than the firstsurface, faces the second substrate 21, as is visible in FIG. 1 .

The electronics assembly 100 also comprises electrically conductivejoint material 16, such as one selected from the group consisting ofsolder material, conductive adhesive, conductive ink, and conductivetape, arranged onto the first 14 and the second connection portions 22to extend between them to electrically connect the electronics module 10to the second circuitry 23 via the electrically conductive jointmaterial 16.

In FIG. 1 , the electrically conductive joint material 16 is illustratedas being at least initially dispensable, preferably flowable, such asconductive adhesive or ink, or melted or stencil printable soldermaterial. However, instead of such materials, for example a conductivetape can be utilized to extend between the first 14 and the secondconnection portions 22 to provide electrical connection via the tape.

As can be seen in FIG. 1 , the at least one first connection portion 14may be arranged on the first surface, that is “above”, the circuitboard. The electrically conductive joint material 16 may thus extendfrom first surface, such as over the at least one first connectionportion 14, to be in contact with the second connection portion 22. Theelectrically conductive joint material 16 may, in addition, be incontact with the adjacent side surface of the circuit board 11 which may(as will be shown and described in connection with FIG. 2 and variousother figures herein) or may not comprise or define part of the firstconnection portion 14.

Furthermore, FIG. 1 illustrates, as an optional feature, a conformalcoating 18, or an encapsulant or glob top layer, on the first surfaceand embedding at least the at least one electronics component 12 andoptionally also portion of the circuit board 11 around component 12. Theconformal coating 18 may be arranged to provide adhesion to a moldedmaterial layer, such as resin, and to avoid electronics components 12becoming damaged, such as due the thermal expansion and/or CTE(coefficient of thermal expansion) mismatch, on the circuit board 11.The conformal coating 18 may be applied on top of circuit board 11 afterit the electronics module 10 has been arranged or assembled onto secondsubstrate 21. This can be done with normal printed circuit board (PCB)production equipment. Material of the conformal coating 18 may be, forexample, however, not limited to plastic spray acrylate. The conformalcoating 18 may be, alternatively or in addition, optically transparent,such as completely clear, or translucent, or opaque. This may beespecially useful if the electronics module 10 is or comprises opticaldevice(s)/component(s).

Still further is shown, as an optional feature, the use of adhesive 24between the electronics module and the second substrate 21. The adhesive24 may be electrically non-conductive adhesive being provided, ordispensed, on the second side of the electronics module 10 or onto thesecond substrate 21. The adhesive 24, that is the second adhesive(preferably different than, in some examples, the conductive adhesive ofthe electrically conductive joint material 16), may comprise or consistof, for example, however, not limited to cyanoacrylate structuraladhesive. In some embodiments, the adhesive 24 may comprise a thermalbuffer, such as rubber.

FIG. 2 illustrates schematically an electronics assembly 100. Theelectronics assembly 100 is in many ways similar to the one illustratedin FIG. 1 , however, the at least one first connection portion 14 isdifferent. In this case, the at least one first connection portion 14extends or substantially completely resides in the adjacent side surfaceof the circuit board 11. As shown in FIG. 2 , the electricallyconductive joint material 16 may only be arranged to be in contact withthe adjacent side surface in order to establish the electricalconnection between the first connection portion 14 and the secondconnection portion 22. Once again, only initially dispensable,preferably flowable, electrically conductive joint material 16 isvisible, however, in some embodiments, conductive tape may be utilizedinstead.

FIG. 3 illustrates schematically an electronics module 10. Theelectronics module 10 is shown as a perspective view. As visible, thecircuit board 11 may optionally comprise vias, such as through-holes,blind, or buried vias as is known to a skilled person in the art.However, as shown in FIG. 3 , the at least one, preferably a pluralityof, first connection portion(s) 14 may define or comprise one or severalcastellated or plated edges or half-holes 17.

Furthermore, in some embodiments, the shape of the circuit board 11 maybe round, oval, ellipse or the like which does not define sharp corners(“sharp” being equal to or less than 90, that is an acute angle, orpreferably less than 120, most preferably less than 135, degrees). Roundshape works well with over molding, such as injection molding, and thereis no need to assemble part to some special orientation. The round shapeespecially may also reduce the need for several mold flow simulationssince the circuit board 11 is symmetrical and thus provides essentiallysame effect on the flow regardless of its position. However, in someembodiments, the shape follows or corresponds to a particular morecomplex shape, such as an icon.

In FIG. 3 , a diameter of the circuit board 11, e.g. PCB, is 10millimeters and it defines or comprises 24 castellated edge connectionportions 17. As understandable, the diameter could be anything, forexample, in the range of about 3 millimeters up to 100 millimeters.However, the diameter is, preferably, such as the electronics module 10defines an electronics component like functional unit. A circuit board11 having diameter of 20 mm might comprise 48, and so on.

The size of the castellated or plated edges or half-holes 17 may be, forexample in the range of 0.2 to 5 millimeters, such as 0.7, 1.5, 2.4,3.6, or 4.2 mm. In some preferable embodiments, the size may be lessthan or at most 1 mm.

Furthermore, it is to be understood that the number of first connectionportions 14, in this case castellated or plated edges or half-holes 17,may be anything, such as in the range of one up to 50 or even more. Forexample, the number may be in the range of four to 36. The electronicsmodule as shown in FIG. 3 may operate, for example, capacitive sensorsand LEDs. It may also be arranged to communicate to other ICs(integrated circuits) via a serial bus, for instance.

As there are no connecting pads underneath the electronics module 10, itcan be assembled directly to the second substrate (e.g. with dispensablecyanoacrylate having rubber buffer providing enhanced resistance toshock and thermal cycling). The second substrate 21 may be, for example,an (FR700) polycarbonate film. Bonding is strong and this allows toplace module 10 even directly under injection molding gate, if aninjection molded layer is to be added on the electronics module 10, aswill be described hereinafter with respect to some embodiments.

In various embodiments, a thin circuit board, such as PCB, may be used(for example, having thickness of 0.2-0.6 mm) since the circuit board 11is adhered to the second substrate 21. Direct attachment also makesthermal path shorter allowing better heat dissipation and more power permodule.

As also described hereinabove, the electrical connection by theelectrically conductive joint material 16 may be done, in someembodiments, with conductive ink. In various embodiments, it isadvantageously to conductive inks, such as stretchable conductive inks,which may be of the same material as in conductive traces of the secondconnection portion 22 and, optionally, also of the traces of the secondcircuitry 23.

The electrically conductive joint material 16 can be dispensed, if atleast initial flowable, such as ink, so that it also covers part of thefirst connection portion 14 on the circuit board 11.

In some embodiments, the viscosity of the ink may be lower than 100 Pa·sat 25 degrees Celsius, such as being in the range of 10 or 15 to 35 or60.

FIG. 4 illustrates schematically an electronics assembly 100. Theelectronics assembly 100 is similar to the one illustrated in FIG. 1 anddescribed in connection thereto. However, same applies also theembodiments in accordance with FIGS. 2 and 3 .

As can be seen, the electronics assembly 100 may further comprise amolded, such as injection molded, material layer 41 embedding theelectronics module 10. The molded material layer 41 may, for example, ofthermoplastic material.

Furthermore, FIG. 4 illustrates an optional third substrate 31, such asa flexible film or sheet, for example, of thermoformable material, suchas of plastic. The third substrate 31 may be laminated onto the moldedmaterial layer 41, or preferably, the molded material layer 41 has beeninjection molded between the second substrate 21 and the third substrate31.

FIG. 5 illustrates schematically an electronics assembly 100. Theelectronics assembly 100 is “above” that is showing the electronicsmodule 10 on the circuit board 11. FIG. 5 also shows a further connectoron the second substrate 21. The further connector may be connected to orbe comprised in the second circuitry 23 on the second substrate 21. Thesecond circuitry 23 may be, for example, printed, such as screen printedor inkjet-printed onto the surface of the second substrate 21. Otherprinting method may also be used.

FIGS. 6A and 6B illustrate schematically an electronics assembly 100.FIG. 6A shows the assembly 100 as a perspective view, FIG. 6B as across-sectional side view. Furthermore, the assembly 100 is similar tothe one shown in FIG. 5 , however, the electronics module 10 has beenarranged into a trench 15 or hole which is clearly visible in FIG. 6B.Thus, the assembly 100, namely the second substrate 21, may comprise thetrench 15, such as including or being a depression or an indentation, tothe second substrate 21, the trench 15 having a shape and a lateral sizesuch that the electronics module 10 fits laterally into the trench 15.Furthermore, the trench may be provided by thermoforming the secondsubstrate 21. The trench 15 may preferably have a shape which is inaccordance with the shape of the module 10, that is follows outlines ofthe module 10. In FIG. 6 , the trench 15 is round, however, it couldhave protrusions at positions of the castellations 17. The trench 15preferably provides a tight fit for the module 10, that is the trench isjust slightly larger than the circuit board 11 in the lateral direction.The electronics module can thus be assembled in the trench 15 afterthermoforming process of the substrate 21. By arranging the electronicsmodule 10 into the trench 15 can provide substantially flat or evensurface to the structure if the electronics module 10 fills the trench15, as is shown in FIG. 6B. By this, cracking or breaking of thesubstrate 21 and/or the electronics module 10 may be avoided or at leastits probability decreased in injection molding process, since thesurface onto which the injection molding is performed is essentiallyflat or even. However, the trench 15 is not necessarily as deep as thethickness of the electronics module 10 or the circuit board 11. Thetrench 15 may be deeper than that or less deep.

The electronics module 10 with the first connection portion 14, such ascastellations 17, may thus be arranged to a thermoformed substrate 21having the trench with a snap-on electromechanical connection. Arrangingthe electronics module 10 to the trench provides protection againstthermal cycling or moisture breaking, and making thinner overallassembly 100 possible.

Thicker circuit board 11 may be used, e.g. 0.6-1.6 mm, for making largersurface area for connection between the first 14 and the second 22connection portions directly and by the electrically conductive jointmaterial 16. In an embodiment, a “vertical” conductive tape may beutilized between the first 14 and the second 22 connection portions.

In some embodiments, the connection portions 14, 22 may be coated withgraphite for better durability on the connection area.

In some embodiments, the trench may be filled with protective coating,similar to the conformal coating or the like filler material.

FIGS. 7A and 7B illustrate schematically an electronics assembly 10. Thecircuit board 11 may comprise a rigid portion 11A and a flex portion 11Battached to each other, wherein the at least one first connectionportion 14 is comprised in the peripheral portion of the flex portion11B. Regarding the electrical connection between the first 14 and thesecond 22 connection portions, the electrically conductive jointmaterial 16 such as described hereinbefore may be utilized as well as,optionally, castellations 17. An adhesive 24, such as electricallynon-conductive adhesive may be utilized to attach the module 10 to thesecond substrate 21 and/or to the third substrate 31 (with, for example,anisotropic conductive film).

As can be seen, in the electronics module 11, several trace orconductive lines from relatively small rigid portion 11A may be easilyestablished. In FIG. 7B, the electrically conductive joint material 16may, preferably, be conductive adhesive, such as anisotropic conductiveadhesive or film. The electronics component 12 may be, for example, anintegrated circuit. In some embodiments, the electronics module 10 mayoperate, for example, as analog front end right next to, for example, asensor even in large IMSE parts. Digital control and power may beprovided from an external source.

In some embodiments, such electronics modules 10 may be utilized in boththe second substrate 21 and the third substrate 31, and optionallyspecifically close to the edge of the substrates 21, 31 for providingconnectors or connector-like arrangements.

Furthermore, the electronics assembly 100 such as shown in FIGS. 7A and7B may be utilized in connection with touchpads, capacitive sliders,button matrixes, capacitive and inductive buttons.

FIG. 8A illustrates schematically an electronics assembly 100. FIG. 8Billustrates schematically an electronics module 10 comprising aconnector 51. The at least one electronics component 12 may, in someembodiments, be a connector 51 for providing electrical connectionbetween an external entity and the first circuitry 13, preferably theconnector 51 extending through a hole in the second substrate 21. Theremay be, in addition, other electronics components 12 on the oppositeside of the circuit board 11, such as shown in FIG. 8A and 8B. Anexternal conductor 59 is also shown which can be connected to theconnector 51.

Furthermore, the first electrical connection portion 14 mayadvantageously comprise castellations 17. The connector 51 may comprisepins 52 or the like and a connector housing 55.

In some embodiments, the second circuitry 23 may comprise a furthersubstrate 61, such as a rigid substrate. There may be furtherelectronics components 62 arranged onto the further substrate 61, suchas high power LEDs.

In various embodiments, the connector 51 may have, for example, 2-8 pinsor terminals with a pitch, for example, in the range of 0.5 mm to 3 mm.However, there can also be up to or even more than 40 pins with smallerpitch, and/or a multirow connector may be used.

In an embodiment, the top side of the module 10, that is the oppositeside relative to the connector 51, may be utilized for variousapplications, such as power noise filtering and power boost withcapacitors, USB-UART (Universal asynchronous receiver-transmitter) orUSB-I2C (Inter-Integrated Circuit communication), USB-SPI (SerialPeripheral Interface) in consumer products, CAN (Controller AreaNetwork)-UART, LIN (Local Interconnect Network)-UART in automotiveapplications, LED driver (MOS)FET, etc.

In some embodiments, the thickness of the circuit board 11 may be morethan 0.6 mm to provide secure platform for connector 51.

Furthermore, the circuit board 11 may comprise holes for attachment pinsof the connector 51 if such are used in the selected connector model.These holes may be utilized in injection molding process to keep themodule 10 in place during the process.

In an embodiment, the connector 51 may be secured and protected with asealant after it has been attached to the circuit board 11.

In some embodiments, the electronics module 10 may be produced bycutting the second substrate 21 open, or removing portion thereof. Thenadhesive 24 may be dispensed on the substrate 21. The circuit board 11may then be assembled without the connector 51. The substrate 21 maythen optionally be thermoformed, if desired. After that an injectionmolded material layer 41 may be provided to embed the circuit board 11and electronics components 12 thereon. Finally, the connector may beattached to the circuit board 11 through the opening in the secondsubstrate 21, such as utilizing heat, infrared, or hot air in solderingthe connector 51 to the circuit board 51. The connector 51 may befurther secured with adhesive.

In some embodiments, the injection molded layer 41 may, alternatively,be provided before removing a portion of the second substrate 21 forarranging the connector 51.

In various embodiments, there may be such electronics modules 10 havingthe connector 51 on both the second 21 and the third 31, if any,substrates.

FIG. 9 illustrates schematically an electronics assembly 100. The atleast one electronics component 12 may, in some embodiments, be asegment display, such as a 7-segment, 8-segment, or 16-segment display.In addition, optionally, the third substrate 31 may be attached to asurface of the segment display being on the opposite side of the displaythan the circuit board 11, as shown in FIG. 9 , such as by an opticallytransparent adhesive, film, or tape. Furthermore, the third substrate 31may be attached to the first surface of the circuit board 11 by thirdadhesive 71, such as an adhesive or film or tape.

FIGS. 10A-10C illustrate schematically an electronics assembly 100. InFIG. 10A is shown similar assembly 100 as in FIG. 2 , for instance,comprising also the third substrate 31 and the molded material layer 41.FIG. 10B shows the same assembly, however, with having a removed portionof the second substrate 21 to expose the circuit board 11 for arrangingthe at least one electronics component 12 on the exposed portion of thesecond surface 21. FIG. 10C shows the electronics assembly of FIG. 10Bso from the opposite side of the second substrate 21 relative to theelectronics module 10. FIG. 10C shows further connection portions 76,such as pads for connecting electronics components 12. The cavity orexposed opening may be filled with conformal coating or other filler 73,such as adhesive, for instance.

With the described process in connection with FIGS. 10A and 10B, forexample, IC chips and other expensive electronic parts are assembledafter part has been manufactured and passed qualification tests.Method/process also increases usable surface on inmold circuit board,such as PCB, as electronics components may now be assembled also intobottom side of the modules 10. Thus, in

FIG. 10B, for instance, the electronics components 12 on the firstsurface may be less expensive and more robust, and on the opposite“bottom” side can reside more expensive and fragile components 12.

FIGS. 11A and 11B illustrate schematically an electronics assembly 100.In FIGS. 11A and 11B especially capacitive sensing device/structures areshown. Therefore, the at least one electronics component 12 may includeone or more capacitive sensing elements, such as electrodes 81. FIGS.11C-11F illustrates related electronics modules 10.

In various embodiments, the electronics module 10 may comprise a groundlayer 84 on the opposite side thereof relative to the one or morecapacitive sensing elements 81, 81A, 81B, namely self-capacitive 81, RX81A, and TX 81B electrodes. There may also be shielding elements 82present in the module 10.

In these embodiments, the module 10 may be utilized to bring capacitiveelectrodes 81, 81A, 81B closer to surface, that is the third substrate31. In various embodiments, the thickness of the circuit board 11 may beabout or more than half of the thickness of the molded material layer41.

In an embodiment shown in 11C, the circuit board 11 with self-capacitiveelectrode 81 and a ground plane 84 may be used to prevent false touchfrom the side of the second substrate 21. Alternatively, the groundplane 84 may be provided onto the second substrate 21 at thecorresponding position with the module 10.

Instead of capacitive sensing elements, there may be appropriatelyinductive or force sensing elements, such as described above relative tothe capacitive sensing elements.

FIG. 11D shows module 10 with mutual capacitive “rake” structure, thatis there is RX 81A electrode in the middle and TX electrodes 81B on bothside thereof. Furthermore, there is also a ground 84 on the oppositeside of the circuit board 11, either on the circuit board 11 or on thesecond substrate 21.

FIG. 11E illustrates a module 10 having projected capacitive structure.The RX 81A and TX electrodes 81B may be routed different way to themodule 10 to prevent false touch. The RX electrode 81A may be hatchedfor better performance.

FIG. 11F illustrates a module 10 with a capacitive button/electrode 81with shield electrodes 82 for water tolerant touch. Also guard electrodecan be applied if running water is present.

FIG. 11G illustrates that there may also be other electronics components12 on the circuit board 11, such as LEDs, for instance.

FIG. 12 illustrates schematically an electronics assembly 100. Theelectronics assembly 100 may comprise the electronics module 10,particularly the circuit board 11 thereof, extending through the moldedmaterial layer 41 between the second 21 and the third 31 substrates forproviding a reliable and high-density connection between two substrates21, 31. The electronics module 10 may be squeezed between the twosubstrates 21, 31. The module 10 maybe assembled in other of thesubstrates 21, 31 in, for example, an SMT process, and then connected toits circuitry 13, 22 with conductive adhesive or ink, or by soldering orconductive tape. Electrical and/or mechanical connection to the otherone of the substrates 21, 31 may then be done with, for example, aanisotropic conductive adhesive or film during injection moldingprocess.

Furthermore, in some embodiments, the electronics component 12, such asshown with dashed lines in upper part of the circuit board 11, may bearranged into a cavity on the first surface of the circuit board 11.

In various embodiments, as described already hereinbefore, anelectronics component 12, such as a fragile IC chip, may be added aftermolding as post process step by removing a portion of the secondsubstrate 21 or into a ready-made opening thereon. The opening may befilled with conformal coating 18 or other filler 73.

The circuit board 11 may also comprise via(s) 91 extending through thecircuit board 11 which may be used to provide the connection between thesubstrates 21, 31. As visible, also the first connection portion 14 mayextending, in thickness direction, through the circuit board 11.

In some embodiments, to better withstand dimensional variations ofcircuit board 11 s during the molding process, silicone rubber moldinsert can be used.

FIGS. 13A-13C illustrate schematically an electronics assembly 100. Invarious embodiments, the circuit board 11 may comprise a cavity 19 onthe first surface thereof, as described briefly hereinbefore.

In various embodiments, a portion of the third substrate 31 may beremoved to expose the cavity 19 for arranging one or several electronicscomponents 12, such as a passive infrared sensor, to the cavity 19.Optionally, the third substrate 31 may be attached by a third adhesiveto the circuit board 11 to surface portion outside the cavity 19 at thefirst side thereof. An optional lens 93, such as a Fresnel and/or aHigh-density polyethylene (HDPE) lens covering the electronicscomponents 12 in case of infrared sensor or the like, since such sensorswork at wavelengths around 7-14 micrometers which are blocked by manythermoplastics like polycarbonate and acrylic. Thus, care must be takento ensure that the sensor operates appropriately.

In various embodiments, the cavity 19 may be exposed by removing aportion of the third substrate after providing the molded material layer41 between the substrates 21, 31.

FIG. 13B illustrates using two circuit boards 11, 11C instead of usingcircuit board 11 with a cavity 19. Thus, a second circuit board 11C maybe attached to the third substrate 31 on the side facing or to be facingthe electronics module 10, wherein the second circuit board 11C maycomprise a through-hole. On the other hand, the second circuit board 11Cmay be directly attached or additionally attached to the circuit board11.

FIG. 13C shows an embodiment in which the circuit board 11 is attachedto the upper substrate, in this case, the second substrate 21. A cavityis provided by an opening in the second substrate 21. In someembodiments, a lens 93 may be used. On the other hand, the electronicscomponent 12, if being an infrared sensor or the like, may include anarrow lens and can fit to small hole define by the opening in thesecond substrate 21.

FIG. 14 illustrates schematically an electronics module 10. The module10 may comprise a protective ring 6 on the circuit board 11 and aroundthe at least one electronics component 12, the protective ring 6optionally comprising a cover 8 on the opposite side relative to thecircuit board 11. These are further illustrated in FIGS. 15A and 15B. Invarious embodiments, the ring 6 and the cover 8 may be manufactured as asingle piece part.

FIGS. 15A and 15B illustrate schematically an electronics assembly 100.The electronics component 12 in these figures is preferable a wirelessmodule for wireless communication. The circuit board 11 may thuscomprise an antenna element 95, or elements 95, such as a printedantenna or a ceramic antenna.

Thus, the electronics component 12, which may be delicate, may be placedinside the module 10 which is assembled between substrates 21, 31. Sidewalls of the protective ring 6 can withstand high molding pressuresespecially if they are low.

FIG. 15A shows the module 10 providing a protective pocket for delicatecomponents 12. Antenna 95 may be a printed antenna, ceramic antenna, orcapacitively coupled antenna utilizing large surface area such as shownin FIG. 15A.

In some embodiments, the ring 6 and the cover 8 may be attached todifferent substrates 21, 31 and then mated during the injection molding.

In some embodiments potting material or other filler 73 may be providedinto a space defined by the protective ring 6 and the circuit board 11,and optionally the cover 8, as shown in FIG. 15B.

FIGS. 16A-16C illustrate schematically an electronics assembly 100. Theelectronics module 10 may further comprise an electrical energy storage29, such as a battery. Furthermore, there may be a vent 33 for eveningout pressure and/or providing ventilation into the space comprising theelectrical energy storage 29. Furthermore, there may be a protectivevent tape 34 arranged onto the vent opening.

In some embodiments, there may also be an optional induction loop 37 orthe like via which electrical energy may be wireless transmitted to themodule 10. Alternatively, as shown in FIG. 16B, a charging port 38 maybe provided. This may be done in similar manner as was describedhereinbefore in connection with FIGS. 8A and 8B for the connector 51.

In some embodiments, the module 10 may comprise a photovoltaic cell 39for providing charging to the electrical energy storage 29. Thephotovoltaic cell 39 may be arranged to between the module 10 and thethird substrate 31. In these cases, the third substrate 31 may betransparent or comprise a transparent window, or merely an opening atthe corresponding position with the photovoltaic cell 39. There may be atransparent adhesive, film, or tape used between the third substrate 31and the photovoltaic cell 39.

FIGS. 17A-17E illustrate schematically an electronics assembly 100. InFIG. 17A, the electronics component 12 is a gas sensor, and in In FIGS.17B-17E, an audio device.

Regarding FIG. 17A, a gas sensor is arranged onto the circuit board 11,and there is a gas vent in fluid communication with the gas sensor viaan opening in the third substrate 31.

The gas sensor may be a barometric pressure sensor, gas compound levelsensor (CO, CO₂, O₂, H₂O, VOC), particle/smoke sensor, or the like.

In various embodiments, the gas sensor is arranged into a cavity on thefirst surface of the circuit board 11 or the protective ring 6 may beutilized. In case of using the ring 6, the protective ring 6 may beassembled/attached on the third substrate 31, such as by adhesive. Thecircuit board 11 may be attached to the second substrate 21. Then thetwo parts may be brought together during the molding. The two parts maybe attached to each other before the molding or even before attaching toa substrate.

In some embodiments, a venting film 49 may be utilized at the opening ofthe third substrate 31.

Regarding FIGS. 17B-17E, the electrical component 12 may be an audiodevice, such as a speaker, a microphone, or an audio transducer, or thelike, such as ultrasound transceiver, buzzers. With these devices it ispossible to implement features like haptics, distance measurements(parking radar), alarm devices (fire alarms) and speakers.

FIG. 17B illustrates an electronic assembly 100 comprising a transducerthat operates based on the whole device surface reflecting or vibratingwith sound. No holes are thus needed in the third substrate 31.

FIG. 17C illustrates an electronic assembly 100 comprising an audiodevice in a cavity on the first surface of the circuit board 11. Thereis also a small opening in the third substrate 31 so that the audiosignal, or sound, can exit the assembly 100 via the opening.

FIG. 17C illustrates an embodiment which comprises an integrated grillor foam cover 77 in the audio device. The cover 77 advantageously fits,preferably tightly, into the opening in the third substrate 31.

FIG. 17D illustrates a ported speaker design improves bass frequencyresponse by having a channel 78 extending within the circuit board 11and from the audio device and through the second substrate 21, therebyacting as a kind of a bass reflex.

FIG. 17E illustrates another ported speaker design in which the channel78 extending within the circuit board 11 and through the third substrate31.

Regarding all FIGS. 17A-17E, the holes or openings in the third 31and/or the second 21 substrate may be produced before the injectionmolding process or after it.

FIG. 18 illustrates schematically an electronics assembly 100. In FIG.18 , the module 10 defines or includes a cavity on the first surface ofthe circuit board 11. There may be a display 89 arranged to an opening,such as a space left by removing a portion of the third substrate 31, inthe third substrate 31. Furthermore, there may be a display flex 88 withwhich the display 89 can be powered and controlled. The display flex 88may be connected to the electronics component 12 on the circuit board11, which may comprise a controller of the display, such as ICs andmemory, etc.

Once again, the cavity may be produced by having a cavity on the circuitboard, or by the protective ring 6, or by having the further circuitboard 11C, such as described in connection with FIG. 13B.

In various embodiments, the display 89 can be arranged to its space andelectrically connected to the component 12 after the injection molding.The assembly 100 may also comprise a bezel 87 for hiding the seams.

FIG. 19 shows a flow diagram of a method for manufacturing anelectronics assembly 100.

Step or item 200 refers to a start-up phase of the method. Suitableequipment and components are obtained and systems assembled andconfigured for operation.

Step or item 210 refers to obtaining or producing 210 an electronicsmodule 10, wherein the electronics module 10 comprises a first circuitry13 on a first surface at a first side of a circuit board 11, at leastone electronics component 12 on the circuit board 11 and in electricalconnection with the first circuitry 13, and at least one firstconnection portion 14 on the first surface and/or an adjacent sidesurface at a peripheral portion of the circuit board 11, wherein the atleast one first connection portion 14 is electrically connected to or iscomprised in the first circuitry. The first circuitry 13 may comprisetraces and/or contact pads, or circuit pattern(s), which may be producedby in an additive, such as printing, or in a subtractive manner, such asetching.

Step or item 220 refers to arranging the electronics module 10 on asecond substrate 21, such as on a thermoformable film or sheet,preferably of plastic material, comprising a second connection portion22 connected to a second circuitry 23 on a surface of the secondsubstrate 21, wherein a second surface of the circuit board 11, being onthe opposite second side than the first surface, faces the secondsubstrate 21. The second circuitry 23 may comprise traces and/or contactpads, or circuit pattern(s), which may be produced by preferably in anadditive, such as printing, or in a subtractive manner, such as etching.

Step or item 230 refers to arranging electrically conductive jointmaterial 16 onto the first 14 and the second connection portions 22 toextend between them for electrically connecting the electronics module10 to the second circuitry 23 via the electrically conductive jointmaterial 16.

In various embodiments, the connection may, thus, preferably be madebetween the top and/or the side surface of the circuit board 11 havingthe at least one, or a plurality of, first connection portion(s) 14 andthe second connection portion 22, preferably arranged onto the topsurface of the second substrate 21. In various embodiments, theelectrically conductive joint material 16 may be one selected from thegroup consisting of: solder material, such as melted or stencil printedsolder, conductive adhesive, conductive ink, conductive tape or film,for example, asymmetric conductive tape or film, or anisotropicconductive film (ACF).

In some embodiments, the electrically conductive joint material 16 maybe at least initially dispensable, preferably flowable, such asconductive adhesive or ink, or melted or stencil printable soldermaterial, and the arranging of the electrically conductive jointmaterial 16 comprises dispensing it on the first 14 and the secondconnection portions 22.

Method execution may be stopped at step or item 299.

In various embodiments, the first connection portion 14 may comprise oneor a plurality of conductive pads at the peripheral portion on the firstsurface at the first side of the circuit board 11.

Alternatively or in addition, the first connection portion 14 mayinclude one or several castellated or plated edges or half-holes 17.They may be arranged to the peripheral portion.

Furthermore, the connection portion 14 may comprise one or several viasor plated holes, such as for facilitating establishing of the electricalconnection by the electrically conductive joint material 16.

The arranging 220 of the electronics module 10 may comprise attachingthe electronics module 10 to the second substrate 21 by a secondadhesive 24, preferably an electrically non-conductive adhesive, such asanisotropic conductive adhesive or film (ACF), provided on the secondside of the electronics module 10.

In various embodiments, the method may comprise applying a conformalcoating 18 onto the first surface to embed at least partly the at leastone electronics component 12.

In some embodiments, the method may comprise forming, such asthermoforming, the second substrate 21 at least locally from a planarshape to exhibit a non-planar or 3D shape, such as a convex and/orconcave surface portion, prior to or after the arranging of theelectronics module 10 on the second substrate 21. The non-planar shapemay be the trench 15 and/or other non-planar shape(s).

As described hereinbefore, the method may comprise providing the trench15, such as including or being a depression or an indentation, to thesecond substrate 21, the trench 15 having a shape and a lateral sizesuch that the electronics module 10 fits laterally into the trench 15,preferably so that at least two side edges of the electronics module 10become in contact with the corresponding side surfaces of the trench 15in the lateral direction. Furthermore, the trench 15 may be provided bythermoforming the second substrate 21.

In various embodiments, the method may comprise obtaining or producingthe circuit board 11 to comprise a rigid portion 11A and a flex portion11B attached to each other. In addition, optionally, the at least onefirst connection portion 14 may be comprised in the peripheral portionof the flex portion 11B.

In some embodiments, the method may comprise the at least oneelectronics component 12 being a connector 51 for providing electricalconnection between an external entity and the first circuitry 13,preferably the connector 51 extending through a hole in the secondsubstrate 21.

Furthermore, the method may comprise arranging a third substrate 31,such as on a thermoformable film or sheet, preferably of plasticmaterial, on the opposite side of the electronics module 10 relative tothe second substrate 21. In addition, optionally, the method maycomprise the at least one electronics component being a segment display,such as a 7-segment, 8-segment, or 16-segment display, and wherein thethird substrate 31 may be attached to a surface of the segment displaybeing on the opposite side of the display than the circuit board 11.

In various embodiments, the third substrate 31 may be attached to thefirst surface of the circuit board 11 and/or the at least oneelectronics component 12, such as the segment display, by thirdadhesive, such as transparent adhesive or transparent adhesive film ortransparent adhesive tape, or non-transparent ones.

In various embodiments, the method may comprise removing a portion ofthe second substrate 21 to expose the circuit board 11 for arranging theat least one electronics component 12 on the exposed portion of thesecond surface.

In some embodiments, the method may comprise providing the circuit board11 as comprising a cavity 19, or producing the cavity 19, on the firstsurface, the method comprising removing a portion of the third substrate31 to expose the cavity 19 for arranging one or several electronicscomponents 12, such as a passive infrared sensor, into the cavity 19. Inaddition, optionally, the method may comprise attaching a second circuitboard 11C to the third substrate 31 on the side facing or to be facingthe electronics module 10, wherein the second circuit board 11Ccomprises a through-hole, and, further optionally, removing a portion ofthe third substrate 31 to expose the through-hole for arranging one orseveral electronics components 12, such as a passive infrared sensor, tothe cavity 19 defined by the through-hole and the circuit board 11.

As described hereinbefore, the method may, preferably, comprise molding,preferably injection molding, material onto a side of the secondsubstrate 21 having the electronics module 10 and at least partlyembedding the electronics module 10 under the molding material, such asbetween the molding material and the second substrate 21.

The method may also comprise, in some embodiments, providing the atleast one electronics component 12 including one or more capacitivesensing elements, such as electrodes. Furthermore, the electronicsmodule 10 may comprise a ground layer on the opposite side thereofrelative to the one or more capacitive sensing elements.

In various embodiments, the method may comprise arranging a protectivering 6 onto the circuit board 11 and around the at least one electronicscomponent 12. The protective ring 6 may optionally comprise a cover 8 onthe opposite side relative to the circuit board 11. Thus, the cavity 19may be formed therewithin.

In some embodiments, the circuit board 11 may comprises an antennaelement, such as a printed antenna or a ceramic antenna, such as on asurface thereof. Alternatively or in addition, the method may compriseproviding potting material into a space, that is the cavity 19, definedby the protective ring 6 and the circuit board 11, and optionally thecover 8.

In various embodiments, the electronics module 10 may further comprisean electrical energy storage, such as a battery. The electrical energystorage may be arranged onto a surface of the circuit board 11 or,alternatively, onto a surface of the cover 8, if any. In someembodiments, the method may further comprise arranging a gas ventthrough the circuit board 11 and the second substrate 21.

In some embodiments, the method may comprise arranging a gas sensor ontothe circuit board 11, and providing a gas vent 33 in fluid communicationwith the gas sensor by removing a portion of the third substrate 31.

In an embodiment, the method may comprise arranging an audio device onthe circuit board 11. Alternatively, the method may comprise arranging ahaptic actuator like linear resonance actuator (LRA) or eccentricresonance motor (ERM).

In some embodiments, the method may comprise arranging a display to aspace left by the removed portion of the third substrate 31.

Furthermore, the first and second circuitry 13, 23 may compriseelectronics components selected from the group consisting of: amicrocontroller, an integrated circuit, a transistor, a resistor, acapacitor, an inductor, a diode, a photodiode, a light-emitting diode, asemiconductor switch, electromechanical component, electro-opticalcomponent, radiation-emitting component, light-emitting component, LED(light-emitting diode), OLED (organic LED), side-shooting LED or otherlight source, top-shooting LED or other light source, bottom-shootingLED or other light source, radiation detecting component,light-detecting or light-sensitive component, photodiode,phototransistor, photovoltaic device, sensor, micromechanical component,switch, touch switch, touch panel, proximity switch, touch sensor,atmospheric sensor, temperature sensor, pressure sensor, moisturesensor, gas sensor, proximity sensor, capacitive switch, capacitivesensor, projected capacitive sensor or switch, single-electrodecapacitive switch or sensor, capacitive button, multi-electrodecapacitive switch or sensor, self-capacitance sensor, mutual capacitivesensor, inductive sensor, sensor electrode, micromechanical component,UI element, user input element, vibration element, sound producingelement, communication element, transmitter, receiver, transceiver,antenna, infrared (IR) receiver or transmitter, wireless communicationelement, wireless tag, radio tag, tag reader, data processing element,microprocessor, microcontroller, digital signal processor, signalprocessor, programmable logic chip, ASIC (application-specificintegrated circuit), data storage element, and electronic sub-assembly.

In various embodiments, electrically conductive elements of circuitries,such as conductive traces, conductors, pads, etc., may include at leastone material selected from the group consisting of: conductive ink,conductive nanoparticle ink, copper, steel, iron, tin, aluminium,silver, gold, platinum, conductive adhesive, carbon fibre, alloy, silveralloy, zinc, brass, titanium, solder, and any component thereof. Theused conductive materials may be optically opaque, translucent and/ortransparent at desired wavelengths, such as at least portion of visiblelight, so as to mask or let the radiation such as visible light to bereflected therefrom, absorbed therein or let through, for instance.

Typically, ready-made components including electronic components such asvarious SMDs may be attached to the contact areas on the substrate(s)e.g. by solder and/or adhesives. For example, light source(s) (e.g.LEDs) of selected technology and pack-aging may be provided here as wellas e.g. different elements of control electronics, communication,sensing, connecting (e.g. connectors), hosting (circuit board(s),car-rier(s), etc.) and/or power provision (e.g. battery) depending onthe embodiment. A suitable pick-and-place or other mounting device maybe utilized for the purpose, for instance. Alternatively oradditionally, printed electronics technology may be applied to actuallymanufacture at least part of the components, such as OLEDs, directlyonto the substrates(s), or specifically the film(s) or sheet(s).

In various embodiments, possible additional layers or generallyfeatures, may be added into the electronics assembly 100 by molding,lamination or suitable coating (e.g. deposition) procedure notforgetting other possible positioning or fixing techniques. The layersmay be of protective, indicative and/or aesthetic value (graphics,colors, figures, text, numeric data, etc.) and contain e.g. textile,leather or rubber materials instead of or in addition to furtherplastics. Additional elements such as electronics, modules, moduleinternals or parts, and/or optics may be installed and fixed e.g. at theouter surface(s) of the structure, such as the exterior surface of anincluded film or a molded layer depending on the embodiment. Necessarymaterial shaping/cutting may take place. For example, a diffuser may beproduced from locally lasering light-guide material. If provided with aconnector, the connector of the multilayer structure may be connected toa desired external connecting element such as an external connector ofan external device, system or structure, e.g. a host device. Forexample, these two connectors may together form a plug-and-socket typeconnection and interface. The multilayer structure may also be generallypositioned and attached herein to a larger ensemble such as anelectronic device such as a personal communications device, computer,household apparatus, industrial device, or e.g. a vehicle in embodimentswherein the multilayer structure establishes a part of vehicle exterioror interior, such as a dashboard.

The scope of the present invention is determined by the attached claimstogether with the equivalents thereof. A person skilled in the art willappreciate the fact that the dis -closed embodiments were constructedfor illustrative purposes only, and other arrangements applying many ofthe above principles could be readily prepared to best suit eachpotential use scenario.

1-33. (canceled)
 34. A method for manufacturing an electronics assembly,comprising: obtaining or producing an electronics module, wherein theelectronics module comprises: a first circuitry on a first surface at afirst side of a circuit board, at least one electronics component on thecircuit board and in electrical connection with the first circuitry, andat least one first connection portion on the first surface and/or anadjacent side surface at a peripheral portion of the circuit board,wherein the at least one first connection portion is at least one ofelectrically connected to or comprised in the first circuitry; arrangingthe electronics module on a second substrate, such as on athermoformable film or sheet comprising a second connection portionconnected to a second circuitry on a surface of the second substrate,wherein a second surface of the circuit board, being on the oppositesecond side than the first surface, faces the second substrate;arranging electrically conductive joint material onto the first and thesecond connection portions to extend between them for electricallyconnecting the electronics module to the second circuitry via theelectrically conductive joint material; and arranging a third substratecomprising at least one of a thermoformable film or sheet on theopposite side of the electronics module relative to the secondsubstrate, and wherein the third substrate is attached to the firstsurface of the circuit board or the at least one electronics componentby a third adhesive.
 35. The method of claim 34 wherein the thirdadhesive comprises at least one of a transparent adhesive or film. 36.The method of claim 34, wherein the electrically conductive jointmaterial comprises at least one of solder material, conductive adhesive,conductive ink, conductive tape or film.
 37. The method of claim 34,wherein the electrically conductive joint material is at least initiallydispensable, and the arranging of the electrically conductive jointmaterial comprises dispensing the electrically conductive joint materialon the first and the second connection portions.
 38. The method of claim34, wherein the first connection portion comprises one or a plurality ofconductive pads at the peripheral portion on the first surface at thefirst side of the circuit board.
 39. The method of claim 34, wherein thefirst connection portion includes one or several castellated or platededges or half-holes.
 40. The method of claim 34, wherein the firstconnection portion comprises one or several vias or plated holes. 41.The method of claim 34, wherein the arranging of the electronics modulecomprises attaching the electronics module to the second substrate by asecond adhesive, preferably an electrically non-conductive adhesive,provided on the second side of the electronics module.
 42. The method ofclaim 34, further comprising applying at least one of a conformalcoating, an encapsulant or a glop top layer onto the first surface toembed at least the electronics component.
 43. The method of claim 34,further comprising forming the second substrate at least locally from aplanar shape to exhibit a non-planar or 3D shape prior to or after thearranging of the electronics module on the second substrate.
 44. Themethod of claim 34, further comprising providing a trench to the secondsubstrate, the trench having a shape and a lateral size such that theelectronics module fits laterally into the trench.
 45. The method ofclaim 44, wherein the trench is provided by thermoforming the secondsubstrate.
 46. The method of claim 34, wherein the circuit boardcomprises a rigid portion and a flex portion attached to each other,wherein the at least one first connection portion is comprised in theperipheral portion of the flex portion.
 47. The method of claim 34,wherein the at least one electronics component is a connector forproviding electrical connection between an external entity and the firstcircuitry, preferably the connector extending through a hole in thesecond substrate.
 48. The method of claim 34, wherein the secondconnection portion is spaced-apart from the at least one firstconnection portion.
 49. The method of claim 34, further comprisingremoving a portion of the second substrate to expose the circuit boardfor arranging the at least one electronics component on the exposedportion of the second surface.
 50. The method of claim 34, wherein thecircuit board comprises a cavity on the first surface, the methodfurther comprising removing a portion of the third substrate to exposethe cavity for arranging one or several electronics components, such asa passive infrared sensor, to the cavity.
 51. The method of claim 34,further comprising: attaching a second circuit board to the thirdsubstrate on the side facing or to be facing the electronics module,wherein the second circuit board comprises a through-hole, and removinga portion of the third substrate to expose the through-hole forarranging one or several electronics components to a cavity defined bythe through-hole and the circuit board.
 52. The method of claim 34,further comprising molding onto a side of the second substrate havingthe electronics module and at least partly embedding the electronicsmodule.
 53. The method of claim 34, wherein the at least one electronicscomponent comprises at least one of a capacitive element, an inductiveelement, or force sensing elements.
 54. The method of claim 53, whereinthe electronics module comprises a ground layer on the opposite sidethereof relative to the one or more capacitive, inductive, or forcesensing elements.
 55. The method of claim 34, further comprisingarranging a protective ring onto the circuit board and around the atleast one electronics component, the protective ring comprising a coveron the opposite side relative to the circuit board.
 56. The method ofclaim 55, wherein the circuit board comprises an antenna element. 57.The method of claim 55, further comprising providing potting materialinto a space defined by the protective ring and the circuit board. 58.The method of claim 34, wherein the electronics module further comprisesan electrical energy storage.
 59. The method of claim 34, furthercomprising at least one of: arranging a gas sensor onto the circuitboard, and providing a gas vent in fluid communication with the gassensor by removing a portion of the third substrate, arranging an audiodevice on the circuit board, or arranging a display to a space left bythe removed portion of the third substrate.
 60. The method of claim 34,wherein the circuit board comprises at least a rigid portion, beingselected from the group consisting of a printed circuit board, a lowtemperature, co-fired ceramic circuit board, and an FR4 circuit board.61. An electronics assembly, comprising: a second substrate, such as athermoformable film or sheet, preferably of plastic material, comprisinga second connection portion connected to a second circuitry on a surfaceof the second substrate, an electronics module, wherein the electronicsmodule comprises: a first circuitry on a first surface at a first sideof a circuit board, at least one electronics component on the circuitboard and in electrical connection with the first circuitry, and atleast one first connection portion on the first surface and/or anadjacent side surface at a peripheral portion of the circuit board,wherein the at least one first connection portion is at least one ofelectrically connected to or is comprised in the first circuitry;wherein a second surface of the circuit board, being on the oppositesecond side than the first surface, faces the second substrate;electrically conductive joint material, such as one selected from thegroup consisting of solder material, conductive adhesive, conductiveink, conductive tape, arranged onto the first and the second connectionportions to extend between them to electrically connect the electronicsmodule to the second circuitry via the electrically conductive jointmaterial, and a third substrate comprising at least one of athermoformable film or sheet on the opposite side of the electronicsmodule relative to the second substrate, wherein the third substrate isattached to the first surface of the circuit board or the at least oneelectronics component by a third adhesive, such as by transparentadhesive or film.
 62. A method for manufacturing an electronicsassembly, comprising: obtaining or producing an electronics module,wherein the electronics module comprises: a first circuitry on a firstsurface at a first side of a circuit board, at least one electronicscomponent on the circuit board and in electrical connection with thefirst circuitry, and at least one first connection portion on the firstsurface and/or an adjacent side surface at a peripheral portion of thecircuit board, wherein the at least one first connection portion is atleast one of electrically connected to or comprised in the firstcircuitry; arranging the electronics module on a second substrateincluding a thermoformable film or sheet comprising a second connectionportion connected to a second circuitry on a surface of the secondsubstrate, wherein the second connection portion is spaced-apart fromthe at least one first connection portion, wherein a second surface ofthe circuit board, being on the opposite second side than the firstsurface, faces the second substrate; arranging electrically conductivejoint material onto the at least one first connection portion and thesecond connection portion such that the electrically conductive jointmaterial extends from the at least one first connection portion to thesecond connection portion to connect the at least one first connectionportion to the second connection portion for electrically connecting theelectronics module to the second circuitry via the electricallyconductive joint material, the electrically conductive joint materialincluding solder material, conductive adhesive, conductive ink,conductive tape, film, or combinations thereof; and arranging a thirdsubstrate comprising at least one of a thermoformable film or sheet onthe opposite side of the electronics module relative to the secondsubstrate, the at least one electronics component being a segmentdisplay, the third substrate being attached to a surface of the segmentdisplay on the opposite side of the display than the circuit board. 63.The electronics assembly of claim 62, further comprising a moldedmaterial layer between the second substrate and the third substrateembedding the electronics module.